Uniform etching for failure analysis of integrated circuits

• Main Author: Yeo, Aloysius Teng Howe
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2023
• Subjects: Engineering::Electrical and electronic engineering; Engineering::Materials
• Online Access: https://hdl.handle.net/10356/169222
• Institution: Nanyang Technological University

Following the trend towards transistor miniaturization and power efficiency in Integrated Circuits (ICs), the concurrent miniaturization of possible defects challenges Failure Analysis (FA) engineers to accurately deprocess ICs with great precision before accessing the defects. As such, etch uniform...