Solventless 3D printed high-temperature resistant cyclosiloxane-containing resin for low-shrinkage ceramization and nano-functional composite development
Digital light processing (DLP) 3D printing technology has the advantage of rapid preparation of high-precision complex devices. However, photosensitive resin's insufficient high-temperature resistance and mechanical properties limit its application in aerospace and structural functional devices...
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| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2023
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/169421 |
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| Institution: | Nanyang Technological University |
| Language: | English |