Characterization of gallium nitride materials for high-frequency and high-power devices

In recent years, a significant progress has been made in the development of III-V Nitrides based devices. Materials such as Aluminium Nitride, Gallium Nitride, Indium Nitride and their alloys have been attractive due to the wide band-gap characteristic. AlGaN/GaN based heterostructures are consi...

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Main Author: Yusuf Anindita Wibawa.
Other Authors: K Radhakrishnan
Format: Final Year Project
Language:English
Published: 2009
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Online Access:http://hdl.handle.net/10356/17065
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-170652023-07-07T16:12:02Z Characterization of gallium nitride materials for high-frequency and high-power devices Yusuf Anindita Wibawa. K Radhakrishnan School of Electrical and Electronic Engineering DRNTU::Engineering::Materials::Material testing and characterization In recent years, a significant progress has been made in the development of III-V Nitrides based devices. Materials such as Aluminium Nitride, Gallium Nitride, Indium Nitride and their alloys have been attractive due to the wide band-gap characteristic. AlGaN/GaN based heterostructures are considered because of their capability of forming direct band-gap heterostructures, high breakdown voltage, high carrier velocity, and excellent chemical stability which are crucial for high power and high frequency applications as future wireless communication. However, the performance of AlGaN/GaN heterostructure High Electron Mobility Transistors (HEMTs) may depend on the ohmic contact characteristic at the interface of the heterostructure. Therefore, there is a necessity to develop a low contact resistance structure. This report describes the electrical properties of GaN based material grown in Sapphire and Silicon substrate including AlGaN/GaN heterostructure and the development of an ohmic contact characteristic to the fabricated devices. The GaN based epitaxial layer had been grown by Molecular Beam Epitaxy system and its electrical characteristics were measured using Hall measurement system (Van Der Pauw Technique). Furthermore, the effect of AlN spacer layer insertion to the grown HEMT structure as well as its temperature dependent electrical characteristics had also been investigated. A particular Ti/Al/Ni/Au contact structure had been successfully deposited in the AlGaN/GaN heterostructure by Electron Beam Evaporation. Its specific contact resistivity was extracted using Transfer Length Method. The resulted specific contact resistivity shows a considerably high value which can be improved through further study. Bachelor of Engineering 2009-05-29T05:00:14Z 2009-05-29T05:00:14Z 2009 2009 Final Year Project (FYP) http://hdl.handle.net/10356/17065 en Nanyang Technological University 91 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials::Material testing and characterization
spellingShingle DRNTU::Engineering::Materials::Material testing and characterization
Yusuf Anindita Wibawa.
Characterization of gallium nitride materials for high-frequency and high-power devices
description In recent years, a significant progress has been made in the development of III-V Nitrides based devices. Materials such as Aluminium Nitride, Gallium Nitride, Indium Nitride and their alloys have been attractive due to the wide band-gap characteristic. AlGaN/GaN based heterostructures are considered because of their capability of forming direct band-gap heterostructures, high breakdown voltage, high carrier velocity, and excellent chemical stability which are crucial for high power and high frequency applications as future wireless communication. However, the performance of AlGaN/GaN heterostructure High Electron Mobility Transistors (HEMTs) may depend on the ohmic contact characteristic at the interface of the heterostructure. Therefore, there is a necessity to develop a low contact resistance structure. This report describes the electrical properties of GaN based material grown in Sapphire and Silicon substrate including AlGaN/GaN heterostructure and the development of an ohmic contact characteristic to the fabricated devices. The GaN based epitaxial layer had been grown by Molecular Beam Epitaxy system and its electrical characteristics were measured using Hall measurement system (Van Der Pauw Technique). Furthermore, the effect of AlN spacer layer insertion to the grown HEMT structure as well as its temperature dependent electrical characteristics had also been investigated. A particular Ti/Al/Ni/Au contact structure had been successfully deposited in the AlGaN/GaN heterostructure by Electron Beam Evaporation. Its specific contact resistivity was extracted using Transfer Length Method. The resulted specific contact resistivity shows a considerably high value which can be improved through further study.
author2 K Radhakrishnan
author_facet K Radhakrishnan
Yusuf Anindita Wibawa.
format Final Year Project
author Yusuf Anindita Wibawa.
author_sort Yusuf Anindita Wibawa.
title Characterization of gallium nitride materials for high-frequency and high-power devices
title_short Characterization of gallium nitride materials for high-frequency and high-power devices
title_full Characterization of gallium nitride materials for high-frequency and high-power devices
title_fullStr Characterization of gallium nitride materials for high-frequency and high-power devices
title_full_unstemmed Characterization of gallium nitride materials for high-frequency and high-power devices
title_sort characterization of gallium nitride materials for high-frequency and high-power devices
publishDate 2009
url http://hdl.handle.net/10356/17065
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