Thermal modelling of integrated liquid cooling solutions for 3D stacked silicon modules

With the advancement in technologies, miniaturisation of electronic components has increased the demand on highly sophisticated cooling solution to remove heat from the high power density compact electronic device. A liquid cooling solution was designed previously for a three-dimensional (3D) silic...

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Bibliographic Details
Main Author: Sin, Kai Chieh.
Other Authors: Toh Kok Chuan
Format: Final Year Project
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/17139
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Institution: Nanyang Technological University
Language: English
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