System design and characterisation of integrated liquid cooling solutions for 3D-stacked modules

Heat densities for electronic packages are increasing as the demand for many functionalities on a single package had resulted in single chip modules being stacked vertically to increase the amount of transistors that can be put on a given footprint. In this study, a liquid cooling solution is propos...

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Bibliographic Details
Main Author: Tan, Siow Pin
Other Authors: Navas Khan
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/18664
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Institution: Nanyang Technological University
Language: English