System design and characterisation of integrated liquid cooling solutions for 3D-stacked modules

• Main Author: Tan, Siow Pin
• Other Authors: Navas Khan
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: https://hdl.handle.net/10356/18664
• Institution: Nanyang Technological University

Heat densities for electronic packages are increasing as the demand for many functionalities on a single package had resulted in single chip modules being stacked vertically to increase the amount of transistors that can be put on a given footprint. In this study, a liquid cooling solution is propos...