Analysis of thermodynamic resistive switching in ZnO-based RRAM device

Due to its excellent performance, resistive random access memory (RRAM) has become one of the most appealing and promising types of memory. However, RRAM has significant problems concerning understanding and modelling the resistive-switching mechanism, despite being very promising from the perspecti...

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Main Authors: Bature, Usman Isyaku, Nawi, Illani Mohd, Khir, Mohd Haris Md, Zahoor, Furqan, Hashwan, Saeed S Ba, Algamili, Abdullah Saleh, Abbas, Haider
Other Authors: School of Computer Science and Engineering
Format: Article
Language:English
Published: 2023
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Online Access:https://hdl.handle.net/10356/172044
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1720442023-11-20T05:21:13Z Analysis of thermodynamic resistive switching in ZnO-based RRAM device Bature, Usman Isyaku Nawi, Illani Mohd Khir, Mohd Haris Md Zahoor, Furqan Hashwan, Saeed S Ba Algamili, Abdullah Saleh Abbas, Haider School of Computer Science and Engineering School of Electrical and Electronic Engineering Engineering::Electrical and electronic engineering Resistive Switching Thermodynamic Process Due to its excellent performance, resistive random access memory (RRAM) has become one of the most appealing and promising types of memory. However, RRAM has significant problems concerning understanding and modelling the resistive-switching mechanism, despite being very promising from the perspectives of scalability and techniques. This paper presents an analysis of thermodynamic resistive switching and fundamentals of thermal energy flow in a ZnO-based RRAM stack. The field and thermal energy flow within the device are analysed using the thermodynamic process. The influence of parameter variations during the SET and RESET operations is shown and their effect on the switching characteristic is characterized. The real I-V characteristics show fixed current vibrations and field-driven ion transport is evidenced and more prominent at higher currents. It shows that the nucleation of the filament as well as the growth of the gap complements the increase in the free energy (FE) of the system. These studies contribute to better comprehension and account for SET-RESET characteristics, rightly unfolding the thermal energy flow during dynamic switching operations that causes device degradation and allowing stability for future data storage projections. 2023-11-20T05:21:13Z 2023-11-20T05:21:13Z 2023 Journal Article Bature, U. I., Nawi, I. M., Khir, M. H. M., Zahoor, F., Hashwan, S. S. B., Algamili, A. S. & Abbas, H. (2023). Analysis of thermodynamic resistive switching in ZnO-based RRAM device. Physica Scripta, 98(3), 035020-. https://dx.doi.org/10.1088/1402-4896/acbb3f 0031-8949 https://hdl.handle.net/10356/172044 10.1088/1402-4896/acbb3f 2-s2.0-85148855295 3 98 035020 en Physica Scripta © 2023 IOP Publishing Ltd. All rights reserved.
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Electrical and electronic engineering
Resistive Switching
Thermodynamic Process
spellingShingle Engineering::Electrical and electronic engineering
Resistive Switching
Thermodynamic Process
Bature, Usman Isyaku
Nawi, Illani Mohd
Khir, Mohd Haris Md
Zahoor, Furqan
Hashwan, Saeed S Ba
Algamili, Abdullah Saleh
Abbas, Haider
Analysis of thermodynamic resistive switching in ZnO-based RRAM device
description Due to its excellent performance, resistive random access memory (RRAM) has become one of the most appealing and promising types of memory. However, RRAM has significant problems concerning understanding and modelling the resistive-switching mechanism, despite being very promising from the perspectives of scalability and techniques. This paper presents an analysis of thermodynamic resistive switching and fundamentals of thermal energy flow in a ZnO-based RRAM stack. The field and thermal energy flow within the device are analysed using the thermodynamic process. The influence of parameter variations during the SET and RESET operations is shown and their effect on the switching characteristic is characterized. The real I-V characteristics show fixed current vibrations and field-driven ion transport is evidenced and more prominent at higher currents. It shows that the nucleation of the filament as well as the growth of the gap complements the increase in the free energy (FE) of the system. These studies contribute to better comprehension and account for SET-RESET characteristics, rightly unfolding the thermal energy flow during dynamic switching operations that causes device degradation and allowing stability for future data storage projections.
author2 School of Computer Science and Engineering
author_facet School of Computer Science and Engineering
Bature, Usman Isyaku
Nawi, Illani Mohd
Khir, Mohd Haris Md
Zahoor, Furqan
Hashwan, Saeed S Ba
Algamili, Abdullah Saleh
Abbas, Haider
format Article
author Bature, Usman Isyaku
Nawi, Illani Mohd
Khir, Mohd Haris Md
Zahoor, Furqan
Hashwan, Saeed S Ba
Algamili, Abdullah Saleh
Abbas, Haider
author_sort Bature, Usman Isyaku
title Analysis of thermodynamic resistive switching in ZnO-based RRAM device
title_short Analysis of thermodynamic resistive switching in ZnO-based RRAM device
title_full Analysis of thermodynamic resistive switching in ZnO-based RRAM device
title_fullStr Analysis of thermodynamic resistive switching in ZnO-based RRAM device
title_full_unstemmed Analysis of thermodynamic resistive switching in ZnO-based RRAM device
title_sort analysis of thermodynamic resistive switching in zno-based rram device
publishDate 2023
url https://hdl.handle.net/10356/172044
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