Development of key wafer-level packaging technologies and design rules for MEMS and biomedical MEMS

• 主要作者: Miao, Jian Min.
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Research Report
• 語言: English
• 出版: 2009
• 主題: DRNTU::Engineering::Manufacturing
• 在線閱讀: http://hdl.handle.net/10356/17245
• 機構: Nanyang Technological University

Three etching masking technologies of Cr/Au, Cr/Cu and PECVD amorphous silicon are developed for Pyrex glass micromachining in the hydrofluoric acid solution. Our study reveals that the residual stress, especially the tensile stress, in the mask layers is responsible for the pinholes on the glass su...