Development of key wafer-level packaging technologies and design rules for MEMS and biomedical MEMS

• المؤلف الرئيسي: Miao, Jian Min.
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: Research Report
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Manufacturing
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/17245
• المؤسسة: Nanyang Technological University

Three etching masking technologies of Cr/Au, Cr/Cu and PECVD amorphous silicon are developed for Pyrex glass micromachining in the hydrofluoric acid solution. Our study reveals that the residual stress, especially the tensile stress, in the mask layers is responsible for the pinholes on the glass su...