Enhancing 3D NAND performance and reliability through overlay control
As microelectronic devices undergo continuous evolution, the ongoing miniaturization of semiconductor chips, coupled with an escalating number of layers, presents a huge challenge in meeting the progressively stringent overlay requirements for every successive generation of chips. Overlay, a metr...
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| Format: | Final Year Project |
| Language: | English |
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Nanyang Technological University
2024
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| Online Access: | https://hdl.handle.net/10356/175986 |
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| Institution: | Nanyang Technological University |
| Language: | English |