Towards building silicon photonics LiDAR chip

Towards building silicon photonics LiDAR chip

Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can in...

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Main Author: Goh, Cai Yu
Other Authors: Nam Donguk
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2024
Subjects:
Engineering
LiDAR
Online Access:https://hdl.handle.net/10356/176899
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1768992024-05-24T15:43:52Z Towards building silicon photonics LiDAR chip Goh, Cai Yu Nam Donguk School of Electrical and Electronic Engineering dnam@ntu.edu.sg Engineering LiDAR Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can integrate the LiDAR components into a small photonic integrated chip (PIC), we can significantly reduce the bulkiness of LiDAR. Hence, this project will investigate the usage of PIC-OPA for LiDAR applications. Bachelor's degree 2024-05-23T04:39:14Z 2024-05-23T04:39:14Z 2024 Final Year Project (FYP) Goh, C. Y. (2024). Towards building silicon photonics LiDAR chip. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/176899 https://hdl.handle.net/10356/176899 en A2146-231 application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering
LiDAR
spellingShingle Engineering
LiDAR
Goh, Cai Yu
Towards building silicon photonics LiDAR chip
description Light detection and ranging (LiDAR) is an excellent sensor for 3D imaging applications. However, the bulkiness and high cost of LiDARs hinder LiDAR from expanding its applications. Advancement in research evaluated that solid-state devices can lower the high cost of LiDARs. Furthermore, if we can integrate the LiDAR components into a small photonic integrated chip (PIC), we can significantly reduce the bulkiness of LiDAR. Hence, this project will investigate the usage of PIC-OPA for LiDAR applications.
author2 Nam Donguk
author_facet Nam Donguk
Goh, Cai Yu
format Final Year Project
author Goh, Cai Yu
author_sort Goh, Cai Yu
title Towards building silicon photonics LiDAR chip
title_short Towards building silicon photonics LiDAR chip
title_full Towards building silicon photonics LiDAR chip
title_fullStr Towards building silicon photonics LiDAR chip
title_full_unstemmed Towards building silicon photonics LiDAR chip
title_sort towards building silicon photonics lidar chip
publisher Nanyang Technological University
publishDate 2024
url https://hdl.handle.net/10356/176899
_version_ 1800916212391084032

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