Electrochemical thin film coating: environmentally friendly etching alternatives for abs

This research investigates the potential application of N-Methyl-2-pyrrolidone (NMP) as an alternative etching solvent and swelling agent for acrylonitrile butadiene styrene (ABS) substrates in the electroless nickel plating (ENP) process. This study aims to evaluate the effectiveness of alternative...

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Bibliographic Details
Main Author: Chin, Rigel Ben Cher
Other Authors: Hirotaka Sato
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2024
Subjects:
Online Access:https://hdl.handle.net/10356/177738
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Institution: Nanyang Technological University
Language: English
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Summary:This research investigates the potential application of N-Methyl-2-pyrrolidone (NMP) as an alternative etching solvent and swelling agent for acrylonitrile butadiene styrene (ABS) substrates in the electroless nickel plating (ENP) process. This study aims to evaluate the effectiveness of alternative solvents for etching and conditioning the ABS surface to promote hydrophilicity for an optimal ENP. ENP process is carried out on the substrate sample. The results are analysed based on the plating thickness and area plated by doing a voltmeter test and tape testing. Examining the quality of plating and amount of nickel deposited on the surface of the sample while tape testing assess the adherence strength of the nickel plating on the surface of the sample.