Non-conductive adhesives for micro joining in semiconductor interconnect applications

• Main Author: Teh, Lay Kuan.
• Other Authors: Wong Chee Cheong
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/19332
• Institution: Nanyang Technological University

This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-ch...