Non-conductive adhesives for micro joining in semiconductor interconnect applications
This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-ch...
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| Online Access: | http://hdl.handle.net/10356/19332 |
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sg-ntu-dr.10356-193322020-06-01T11:56:52Z Non-conductive adhesives for micro joining in semiconductor interconnect applications Teh, Lay Kuan. Wong Chee Cheong School of Materials Science & Engineering DRNTU::Engineering::Materials This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-chip assembled on FR4 epoxy printed circuit board (PCB) substrates with NCAs. Master of Engineering (MSE) 2009-12-08T06:04:09Z 2009-12-08T06:04:09Z 2003 2003 Thesis http://hdl.handle.net/10356/19332 en 113 p. application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| country |
Singapore |
| collection |
DR-NTU |
| language |
English |
| topic |
DRNTU::Engineering::Materials |
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DRNTU::Engineering::Materials Teh, Lay Kuan. Non-conductive adhesives for micro joining in semiconductor interconnect applications |
| description |
This work addresses the impact of NCA materials employed on the reliability performance of flip-chip package. Four commercially available non-conductive adhesives (NCAs), designed as NCA-A, NCA-B, NCA-C and NCA-D were investigated. The test vehicle used as a 4x4 mm, electroless Ni-Au bumped flip-chip assembled on FR4 epoxy printed circuit board (PCB) substrates with NCAs. |
| author2 |
Wong Chee Cheong |
| author_facet |
Wong Chee Cheong Teh, Lay Kuan. |
| format |
Theses and Dissertations |
| author |
Teh, Lay Kuan. |
| author_sort |
Teh, Lay Kuan. |
| title |
Non-conductive adhesives for micro joining in semiconductor interconnect applications |
| title_short |
Non-conductive adhesives for micro joining in semiconductor interconnect applications |
| title_full |
Non-conductive adhesives for micro joining in semiconductor interconnect applications |
| title_fullStr |
Non-conductive adhesives for micro joining in semiconductor interconnect applications |
| title_full_unstemmed |
Non-conductive adhesives for micro joining in semiconductor interconnect applications |
| title_sort |
non-conductive adhesives for micro joining in semiconductor interconnect applications |
| publishDate |
2009 |
| url |
http://hdl.handle.net/10356/19332 |
| _version_ |
1681057912428953600 |