Processing and characterization of electrically conductive adhesives
Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/19344 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging. |
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