Processing and characterization of electrically conductive adhesives
Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the...
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2009
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sg-ntu-dr.10356-193442023-03-04T16:34:01Z Processing and characterization of electrically conductive adhesives Yong, Sim Seah. Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging. Master of Engineering (MSE) 2009-12-10T07:12:22Z 2009-12-10T07:12:22Z 2004 2004 Thesis http://hdl.handle.net/10356/19344 en 79 p. application/pdf |
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DRNTU::Engineering::Materials Yong, Sim Seah. Processing and characterization of electrically conductive adhesives |
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Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging. |
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Subodh Gautam Mhaisalkar |
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Subodh Gautam Mhaisalkar Yong, Sim Seah. |
format |
Theses and Dissertations |
author |
Yong, Sim Seah. |
author_sort |
Yong, Sim Seah. |
title |
Processing and characterization of electrically conductive adhesives |
title_short |
Processing and characterization of electrically conductive adhesives |
title_full |
Processing and characterization of electrically conductive adhesives |
title_fullStr |
Processing and characterization of electrically conductive adhesives |
title_full_unstemmed |
Processing and characterization of electrically conductive adhesives |
title_sort |
processing and characterization of electrically conductive adhesives |
publishDate |
2009 |
url |
http://hdl.handle.net/10356/19344 |
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1759855290878001152 |