Processing and characterization of electrically conductive adhesives

Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the...

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Main Author: Yong, Sim Seah.
Other Authors: Subodh Gautam Mhaisalkar
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19344
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-193442023-03-04T16:34:01Z Processing and characterization of electrically conductive adhesives Yong, Sim Seah. Subodh Gautam Mhaisalkar School of Materials Science & Engineering DRNTU::Engineering::Materials Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging. Master of Engineering (MSE) 2009-12-10T07:12:22Z 2009-12-10T07:12:22Z 2004 2004 Thesis http://hdl.handle.net/10356/19344 en 79 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Yong, Sim Seah.
Processing and characterization of electrically conductive adhesives
description Electrically Conductive Adhesives (ECAs) are fast emerging as a promising solder alternative solutions. It is playing an increasingly important role in the design and production of electronic packages. Fewer processing steps and lower curing temperatures as compared to the solder technology are the main reasons driving their increasing implementation in microelectronics packaging.
author2 Subodh Gautam Mhaisalkar
author_facet Subodh Gautam Mhaisalkar
Yong, Sim Seah.
format Theses and Dissertations
author Yong, Sim Seah.
author_sort Yong, Sim Seah.
title Processing and characterization of electrically conductive adhesives
title_short Processing and characterization of electrically conductive adhesives
title_full Processing and characterization of electrically conductive adhesives
title_fullStr Processing and characterization of electrically conductive adhesives
title_full_unstemmed Processing and characterization of electrically conductive adhesives
title_sort processing and characterization of electrically conductive adhesives
publishDate 2009
url http://hdl.handle.net/10356/19344
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