Cost modeling of multichip modules substrates technology in concurrent engineering
Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/19915 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development. |
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