Cost modeling of multichip modules substrates technology in concurrent engineering

• Main Author: Mok, Mun Fai.
• Other Authors: Leong, Kah Fai
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/19915
• Institution: Nanyang Technological University

Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess...