Cost modeling of multichip modules substrates technology in concurrent engineering
Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess...
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sg-ntu-dr.10356-199152023-03-11T17:04:01Z Cost modeling of multichip modules substrates technology in concurrent engineering Mok, Mun Fai. Leong, Kah Fai School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development. Master of Science 2009-12-14T07:12:46Z 2009-12-14T07:12:46Z 1997 1997 Thesis http://hdl.handle.net/10356/19915 en NANYANG TECHNOLOGICAL UNIVERSITY 96 p. application/pdf |
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Nanyang Technological University |
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Asia |
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Singapore Singapore |
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English |
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DRNTU::Engineering::Manufacturing |
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DRNTU::Engineering::Manufacturing Mok, Mun Fai. Cost modeling of multichip modules substrates technology in concurrent engineering |
| description |
Choosing and developing advance electronic packaging technology to meet product needs often carry ill-affordable alternatives late into the decision process. During the concept exploration and defmition (CE & D) phase of products and its manufacturing processes, designers must be able to assess both the performance and cost impacts of their choices. Early decisions made during the CE & D phase will drive the cost of future programs/products more than any other phase of development. |
| author2 |
Leong, Kah Fai |
| author_facet |
Leong, Kah Fai Mok, Mun Fai. |
| format |
Theses and Dissertations |
| author |
Mok, Mun Fai. |
| author_sort |
Mok, Mun Fai. |
| title |
Cost modeling of multichip modules substrates technology in concurrent engineering |
| title_short |
Cost modeling of multichip modules substrates technology in concurrent engineering |
| title_full |
Cost modeling of multichip modules substrates technology in concurrent engineering |
| title_fullStr |
Cost modeling of multichip modules substrates technology in concurrent engineering |
| title_full_unstemmed |
Cost modeling of multichip modules substrates technology in concurrent engineering |
| title_sort |
cost modeling of multichip modules substrates technology in concurrent engineering |
| publishDate |
2009 |
| url |
http://hdl.handle.net/10356/19915 |
| _version_ |
1761781415719993344 |