Development of an alternative rework process for ceramic ball grid array 256 (CBGA256) assembly
In the assembly of ceramic ball grid array (CBGA) packages to a printed circuit board, various factors could affect the functionality of the package. A rework operation which removes and replaces the defective component is thus required. However, the deficiency of the site preparation has become the...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2009
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| 在線閱讀: | http://hdl.handle.net/10356/19926 |
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