Development of a chip-on-tape encapsulation process
This thesis summarizes the work conducted in an effort to develop an encapsulation process for a chip-on-tape package. The various studies conducted included encapsulation material selection, encapsulation process studies and optimization and FEA simulations for the prediction of package performance...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2009
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/20541 |
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