Reliability analysis of surface mount solder joints
The reliability of solder joints was studied through experimental and finite element analysis (FEA) approaches. A no clean surface mount process for the assembly of Plastic Quad Flat Packs (PQFPs) with 15.7 mil (0.4 mm) pitch and 256 leads was established. Samples were tested under temperature range...
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2009
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sg-ntu-dr.10356-205502020-09-26T22:14:18Z Reliability analysis of surface mount solder joints Yeo, Chee Keng. Pang, Hock Lye John Gintic Institute of Manufacturing Technology DRNTU::Engineering::Manufacturing::Product design The reliability of solder joints was studied through experimental and finite element analysis (FEA) approaches. A no clean surface mount process for the assembly of Plastic Quad Flat Packs (PQFPs) with 15.7 mil (0.4 mm) pitch and 256 leads was established. Samples were tested under temperature range of between negative 55 degrees celcius to 125 degrees celcius to study the microstructure change and fatigue life of solder joints. Observations of microstmcture changes such as the growth of intermetallics, grain coarsening as well as thermal fatigue cracks were made. Master of Engineering (GINTIC) 2009-12-15T03:18:04Z 2009-12-15T03:18:04Z 1995 1995 Thesis http://hdl.handle.net/10356/20550 en NANYANG TECHNOLOGICAL UNIVERSITY 149 p. application/pdf |
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Nanyang Technological University |
| building |
NTU Library |
| country |
Singapore |
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DR-NTU |
| language |
English |
| topic |
DRNTU::Engineering::Manufacturing::Product design |
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DRNTU::Engineering::Manufacturing::Product design Yeo, Chee Keng. Reliability analysis of surface mount solder joints |
| description |
The reliability of solder joints was studied through experimental and finite element analysis (FEA) approaches. A no clean surface mount process for the assembly of Plastic Quad Flat Packs (PQFPs) with 15.7 mil (0.4 mm) pitch and 256 leads was established. Samples were tested under temperature range of between negative 55 degrees celcius to 125 degrees celcius to study the microstructure change and fatigue life of solder joints. Observations of microstmcture changes such as the growth of intermetallics, grain coarsening as well as thermal fatigue cracks were made. |
| author2 |
Pang, Hock Lye John |
| author_facet |
Pang, Hock Lye John Yeo, Chee Keng. |
| format |
Theses and Dissertations |
| author |
Yeo, Chee Keng. |
| author_sort |
Yeo, Chee Keng. |
| title |
Reliability analysis of surface mount solder joints |
| title_short |
Reliability analysis of surface mount solder joints |
| title_full |
Reliability analysis of surface mount solder joints |
| title_fullStr |
Reliability analysis of surface mount solder joints |
| title_full_unstemmed |
Reliability analysis of surface mount solder joints |
| title_sort |
reliability analysis of surface mount solder joints |
| publishDate |
2009 |
| url |
http://hdl.handle.net/10356/20550 |
| _version_ |
1681059252841480192 |