Reliability analysis of surface mount solder joints
The reliability of solder joints was studied through experimental and finite element analysis (FEA) approaches. A no clean surface mount process for the assembly of Plastic Quad Flat Packs (PQFPs) with 15.7 mil (0.4 mm) pitch and 256 leads was established. Samples were tested under temperature range...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/20550 |
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| Institution: | Nanyang Technological University |
| Language: | English |