Reliability analysis of surface mount solder joints

• المؤلف الرئيسي: Yeo, Chee Keng.
• مؤلفون آخرون: Pang, Hock Lye John
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Manufacturing::Product design
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/20550
• المؤسسة: Nanyang Technological University

The reliability of solder joints was studied through experimental and finite element analysis (FEA) approaches. A no clean surface mount process for the assembly of Plastic Quad Flat Packs (PQFPs) with 15.7 mil (0.4 mm) pitch and 256 leads was established. Samples were tested under temperature range...