Theoretical formulations and computational modeling of flexible circuit's behaviour

• 主要作者: Loh, Tick Boon.
• 其他作者: Chai Gin Boay
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2009
• 主題: DRNTU::Engineering::Mechanical engineering
• 在線閱讀: http://hdl.handle.net/10356/20667
• 機構: Nanyang Technological University

In this report, an in-depth study on the behaviour of the Hewlett-Packard flexible circuit when cooled from the elevated curing temperature to room temperature is presented. The purpose of this study is to develop a mathematical model using the Classical Laminate Theory in conjunction with the mini...