Simulation of heat flow in 3D packages with flexible circuits
Improvement the thermal management by using the two miniature heat sinks mounted on the two chips. The flexible circuits are folded in a manner that the chips with and without the diamond heat sinks are stacking on each other.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Theses and Dissertations |
| Published: |
2008
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10356/5947 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | Nanyang Technological University |