Theoretical formulations and computational modeling of flexible circuit's behaviour

In this report, an in-depth study on the behaviour of the Hewlett-Packard flexible circuit when cooled from the elevated curing temperature to room temperature is presented. The purpose of this study is to develop a mathematical model using the Classical Laminate Theory in conjunction with the mini...

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Bibliographic Details
Main Author: Loh, Tick Boon.
Other Authors: Chai Gin Boay
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/20667
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Institution: Nanyang Technological University
Language: English