Theoretical formulations and computational modeling of flexible circuit's behaviour

• المؤلف الرئيسي: Loh, Tick Boon.
• مؤلفون آخرون: Chai Gin Boay
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2009
• الموضوعات: DRNTU::Engineering::Mechanical engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/20667

In this report, an in-depth study on the behaviour of the Hewlett-Packard flexible circuit when cooled from the elevated curing temperature to room temperature is presented. The purpose of this study is to develop a mathematical model using the Classical Laminate Theory in conjunction with the mini...