Theoretical formulations and computational modeling of flexible circuit's behaviour
In this report, an in-depth study on the behaviour of the Hewlett-Packard flexible circuit when cooled from the elevated curing temperature to room temperature is presented. The purpose of this study is to develop a mathematical model using the Classical Laminate Theory in conjunction with the mini...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2009
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/20667 |
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| 機構: | Nanyang Technological University |
| 語言: | English |