Theoretical formulations and computational modeling of flexible circuit's behaviour

• Main Author: Loh, Tick Boon.
• Other Authors: Chai Gin Boay
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/20667
• Institution: Nanyang Technological University

In this report, an in-depth study on the behaviour of the Hewlett-Packard flexible circuit when cooled from the elevated curing temperature to room temperature is presented. The purpose of this study is to develop a mathematical model using the Classical Laminate Theory in conjunction with the mini...