Simulation of heat flow in 3D packages with flexible circuits
Improvement the thermal management by using the two miniature heat sinks mounted on the two chips. The flexible circuits are folded in a manner that the chips with and without the diamond heat sinks are stacking on each other.
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2008
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| Online Access: | http://hdl.handle.net/10356/5947 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-59472023-03-11T17:18:09Z Simulation of heat flow in 3D packages with flexible circuits Lee, Teck Soon. Zhong, Zhaowei School of Mechanical and Production Engineering DRNTU::Engineering::Mechanical engineering Improvement the thermal management by using the two miniature heat sinks mounted on the two chips. The flexible circuits are folded in a manner that the chips with and without the diamond heat sinks are stacking on each other. Master of Science (Precision Engineering) 2008-09-17T11:03:05Z 2008-09-17T11:03:05Z 2004 2004 Thesis http://hdl.handle.net/10356/5947 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Mechanical engineering |
| spellingShingle |
DRNTU::Engineering::Mechanical engineering Lee, Teck Soon. Simulation of heat flow in 3D packages with flexible circuits |
| description |
Improvement the thermal management by using the two miniature heat sinks mounted on the two chips. The flexible circuits are folded in a manner that the chips with and without the diamond heat sinks are stacking on each other. |
| author2 |
Zhong, Zhaowei |
| author_facet |
Zhong, Zhaowei Lee, Teck Soon. |
| format |
Theses and Dissertations |
| author |
Lee, Teck Soon. |
| author_sort |
Lee, Teck Soon. |
| title |
Simulation of heat flow in 3D packages with flexible circuits |
| title_short |
Simulation of heat flow in 3D packages with flexible circuits |
| title_full |
Simulation of heat flow in 3D packages with flexible circuits |
| title_fullStr |
Simulation of heat flow in 3D packages with flexible circuits |
| title_full_unstemmed |
Simulation of heat flow in 3D packages with flexible circuits |
| title_sort |
simulation of heat flow in 3d packages with flexible circuits |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/5947 |
| _version_ |
1761781801133539328 |