Design of on-package RF dual-band filter

Design of on-package RF dual-band filter

In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In th...

Full description

Saved in:
Bibliographic Details
Main Author: Anak Agung Alit Apriyana
Other Authors: Zhang, Yue Ping
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
Online Access:http://hdl.handle.net/10356/2556
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Description
Summary:In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In this case, the filter was implemented using a transmission line rather than a lumped element to minimize losses.

Similar Items