Design of on-package RF dual-band filter
In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In th...
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Format: | Theses and Dissertations |
Published: |
2008
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Online Access: | http://hdl.handle.net/10356/2556 |
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Institution: | Nanyang Technological University |
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