Design of on-package RF dual-band filter

Design of on-package RF dual-band filter

In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In th...

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Main Author: Anak Agung Alit Apriyana
Other Authors: Zhang, Yue Ping
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
Online Access:http://hdl.handle.net/10356/2556
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-2556
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spelling sg-ntu-dr.10356-25562023-03-04T00:29:37Z Design of on-package RF dual-band filter Anak Agung Alit Apriyana Zhang, Yue Ping School of Computer Engineering DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In this case, the filter was implemented using a transmission line rather than a lumped element to minimize losses. Master of Philosophy 2008-09-17T09:05:21Z 2008-09-17T09:05:21Z 2004 2004 Thesis http://hdl.handle.net/10356/2556 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
Anak Agung Alit Apriyana
Design of on-package RF dual-band filter
description In this project, a dual-band BPF for the concurrent dual-band wireless transceiver was developed. The dual-band BPF was implemented using ceramic material to obtain a low insertion loss performance. In order to minimize the device area, the dual-band BPF was place on the top of the IC package. In this case, the filter was implemented using a transmission line rather than a lumped element to minimize losses.
author2 Zhang, Yue Ping
author_facet Zhang, Yue Ping
Anak Agung Alit Apriyana
format Theses and Dissertations
author Anak Agung Alit Apriyana
author_sort Anak Agung Alit Apriyana
title Design of on-package RF dual-band filter
title_short Design of on-package RF dual-band filter
title_full Design of on-package RF dual-band filter
title_fullStr Design of on-package RF dual-band filter
title_full_unstemmed Design of on-package RF dual-band filter
title_sort design of on-package rf dual-band filter
publishDate 2008
url http://hdl.handle.net/10356/2556
_version_ 1759855086389952512

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