Fabrication and characterisation of microelectronic devices, circuits and systems III

We present in this report the characterization of deep submicrometer (the device channel length ranges from 0.25um to 1.0um) lightly-doped drain (LDD) pMOSFETs operating in a Bi-MOS structure. The Bi-MOS structure is essentially a device operating with its sourcebody junction forward biased. Cons...

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Main Author: Siek, Liter.
Other Authors: School of Electrical and Electronic Engineering
Format: Research Report
Published: 2008
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Online Access:http://hdl.handle.net/10356/2754
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Institution: Nanyang Technological University
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spelling sg-ntu-dr.10356-27542023-03-04T03:20:35Z Fabrication and characterisation of microelectronic devices, circuits and systems III Siek, Liter. School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics We present in this report the characterization of deep submicrometer (the device channel length ranges from 0.25um to 1.0um) lightly-doped drain (LDD) pMOSFETs operating in a Bi-MOS structure. The Bi-MOS structure is essentially a device operating with its sourcebody junction forward biased. Consequently, there is an additional current component, the lateral bipolar current, flwoing beneath the principle MOS current. RGM 17/99 2008-09-17T09:14:17Z 2008-09-17T09:14:17Z 2001 2001 Research Report http://hdl.handle.net/10356/2754 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Siek, Liter.
Fabrication and characterisation of microelectronic devices, circuits and systems III
description We present in this report the characterization of deep submicrometer (the device channel length ranges from 0.25um to 1.0um) lightly-doped drain (LDD) pMOSFETs operating in a Bi-MOS structure. The Bi-MOS structure is essentially a device operating with its sourcebody junction forward biased. Consequently, there is an additional current component, the lateral bipolar current, flwoing beneath the principle MOS current.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Siek, Liter.
format Research Report
author Siek, Liter.
author_sort Siek, Liter.
title Fabrication and characterisation of microelectronic devices, circuits and systems III
title_short Fabrication and characterisation of microelectronic devices, circuits and systems III
title_full Fabrication and characterisation of microelectronic devices, circuits and systems III
title_fullStr Fabrication and characterisation of microelectronic devices, circuits and systems III
title_full_unstemmed Fabrication and characterisation of microelectronic devices, circuits and systems III
title_sort fabrication and characterisation of microelectronic devices, circuits and systems iii
publishDate 2008
url http://hdl.handle.net/10356/2754
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