Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits

This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (r...

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Main Author:	Purakh Raj Verma.
Other Authors:	Lau, Michael Wai Shing
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Online Access:	http://hdl.handle.net/10356/3148
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Institution:	Nanyang Technological University

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spelling	sg-ntu-dr.10356-31482023-07-04T15:18:41Z Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits Purakh Raj Verma. Lau, Michael Wai Shing School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (resistors & capacitor) and active components (mainly MOS transistors) are discussed in detail. Master of Science (Microelectronics) 2008-09-17T09:23:17Z 2008-09-17T09:23:17Z 2003 2003 Thesis http://hdl.handle.net/10356/3148 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits Purakh Raj Verma. Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
description	This project focues on the evaluation of the various characterization techniques and test structure designs for both active and passive component used in deep sub-micron high frequency mixed signal (analog/digital) integrated circuits. Key device parameters and matching of both passive components (resistors & capacitor) and active components (mainly MOS transistors) are discussed in detail.
author2	Lau, Michael Wai Shing
author_facet	Lau, Michael Wai Shing Purakh Raj Verma.
format	Theses and Dissertations
author	Purakh Raj Verma.
author_sort	Purakh Raj Verma.
title	Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_short	Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_full	Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_fullStr	Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_full_unstemmed	Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
title_sort	review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits
publishDate	2008
url	http://hdl.handle.net/10356/3148
_version_	1772828139270963200

Review and analysis of device characterization structures and methodologies used for mixed signal integrated circuits

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