The review on the cohesive properties of thin film

• Main Author: Norhayati Abd Rahim.
• Other Authors: Su Haibin
• Format: Final Year Project
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• Online Access: http://hdl.handle.net/10356/35657
• Institution: Nanyang Technological University

During the recent years, the application of thin film has been widely used due to the fact that the properties are comparable to that of the thick film application. However, there are a few problems that the application of thin film has that will affect the cohesive properties as well as other properties such as the mechanical strength, optical properties, etc. These problems are mainly the interaction between the thin film and the substrate, the deposition method, the type of forces between the thin film and substrate, the crystallographic structure of the thin film, the stress field found and the defects. Thus for this project, further explanations will be made with regards to these problems some solutions will discussed or proposed so as to minimize these problems since they can not be eliminated totally.