Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate

• Main Author: Hu, YingYong
• Other Authors: Huang Weimin
• Format: Theses and Dissertations
• Language: English
• Published: 2011
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• Online Access: https://hdl.handle.net/10356/46439
• Institution: Nanyang Technological University

Stress and thermomechanical behavior of thin films deposited atop a substrate upon thermal loading/unloading have been investigated extensively in the past decades, which was partially stimulated by the development of micro- and nanotechnology. However, most of the previous effort in analysis was fo...