Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate
Stress and thermomechanical behavior of thin films deposited atop a substrate upon thermal loading/unloading have been investigated extensively in the past decades, which was partially stimulated by the development of micro- and nanotechnology. However, most of the previous effort in analysis was fo...
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格式: | Theses and Dissertations |
語言: | English |
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2011
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在線閱讀: | https://hdl.handle.net/10356/46439 |
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機構: | Nanyang Technological University |
語言: | English |