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Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate

Stress and thermomechanical behavior of thin films deposited atop a substrate upon thermal loading/unloading have been investigated extensively in the past decades, which was partially stimulated by the development of micro- and nanotechnology. However, most of the previous effort in analysis was fo...

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書目詳細資料
主要作者: Hu, YingYong
其他作者: Huang Weimin
格式: Theses and Dissertations
語言:English
出版: 2011
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在線閱讀:https://hdl.handle.net/10356/46439
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機構: Nanyang Technological University
語言: English