Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate

Stress and thermomechanical behavior of thin films deposited atop a substrate upon thermal loading/unloading have been investigated extensively in the past decades, which was partially stimulated by the development of micro- and nanotechnology. However, most of the previous effort in analysis was fo...

Full description

Saved in:
Bibliographic Details
Main Author: Hu, YingYong
Other Authors: Huang Weimin
Format: Theses and Dissertations
Language:English
Published: 2011
Subjects:
Online Access:https://hdl.handle.net/10356/46439
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English
Be the first to leave a comment!
You must be logged in first