Mechanics of thin film adhesion

Mechanics of thin film adhesion

The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively.

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Bibliographic Details
Main Author: Duan, Jin.
Other Authors: School of Mechanical and Production Engineering
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:http://hdl.handle.net/10356/5686
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Institution: Nanyang Technological University

Internet

http://hdl.handle.net/10356/5686

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