Mechanics of thin film adhesion
The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively.
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/5686 |
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| Institution: | Nanyang Technological University |