Mechanics of thin film adhesion
The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively.
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2008
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sg-ntu-dr.10356-56862023-03-11T17:10:39Z Mechanics of thin film adhesion Duan, Jin. School of Mechanical and Production Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively. Master of Engineering (MPE) 2008-09-17T10:56:41Z 2008-09-17T10:56:41Z 2002 2002 Thesis http://hdl.handle.net/10356/5686 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films Duan, Jin. Mechanics of thin film adhesion |
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The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively. |
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School of Mechanical and Production Engineering |
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School of Mechanical and Production Engineering Duan, Jin. |
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Theses and Dissertations |
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Duan, Jin. |
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Duan, Jin. |
title |
Mechanics of thin film adhesion |
title_short |
Mechanics of thin film adhesion |
title_full |
Mechanics of thin film adhesion |
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Mechanics of thin film adhesion |
title_full_unstemmed |
Mechanics of thin film adhesion |
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mechanics of thin film adhesion |
publishDate |
2008 |
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http://hdl.handle.net/10356/5686 |
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1761781190076923904 |