Mechanics of thin film adhesion

The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively.

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Bibliographic Details
Main Author:	Duan, Jin.
Other Authors:	School of Mechanical and Production Engineering
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Online Access:	http://hdl.handle.net/10356/5686
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Institution:	Nanyang Technological University

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Mechanics of thin film adhesion

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