A structured approach for routing of high density PCB
The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodolog...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/3579 |
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| Institution: | Nanyang Technological University |
| Summary: | The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodology can guarantee 100% completion of auto routing and pre-determine the number of layer required. |
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