A structured approach for routing of high density PCB

The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodolog...

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Bibliographic Details
Main Author:	Thein Po.
Other Authors:	Chua, Hong Chuek
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Online Access:	http://hdl.handle.net/10356/3579
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-3579
record_format	dspace
spelling	sg-ntu-dr.10356-35792023-07-04T15:17:35Z A structured approach for routing of high density PCB Thein Po. Chua, Hong Chuek School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodology can guarantee 100% completion of auto routing and pre-determine the number of layer required. Master of Science (Consumer Electronics) 2008-09-17T09:32:52Z 2008-09-17T09:32:52Z 2005 2005 Thesis http://hdl.handle.net/10356/3579 Nanyang Technological University application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
spellingShingle	DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits Thein Po. A structured approach for routing of high density PCB
description	The aim of this project is to design a Structured Methodology for Routing of High Density Printed Circuit Board (PCB). PCB may include the through hole components and Surface Mounted Technology (SMT) components. The routing methodology is based on the Modularized Routing Methodology. This methodology can guarantee 100% completion of auto routing and pre-determine the number of layer required.
author2	Chua, Hong Chuek
author_facet	Chua, Hong Chuek Thein Po.
format	Theses and Dissertations
author	Thein Po.
author_sort	Thein Po.
title	A structured approach for routing of high density PCB
title_short	A structured approach for routing of high density PCB
title_full	A structured approach for routing of high density PCB
title_fullStr	A structured approach for routing of high density PCB
title_full_unstemmed	A structured approach for routing of high density PCB
title_sort	structured approach for routing of high density pcb
publishDate	2008
url	http://hdl.handle.net/10356/3579
_version_	1772826671947186176

A structured approach for routing of high density PCB

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