Characterization of lead free solder joints in microelectronics assemblies
71 p.
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| Format: | Theses and Dissertations |
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2010
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| Online Access: | http://hdl.handle.net/10356/36056 |
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| Institution: | Nanyang Technological University |
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sg-ntu-dr.10356-360562023-03-11T17:07:19Z Characterization of lead free solder joints in microelectronics assemblies Hla Phone Maw. Zhong Zhaowei School of Mechanical and Aerospace Engineering DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics 71 p. Wafer level packaging using organic substrate is being used for traditional electronic packages in demanding miniaturization of products. The organic substrates may not be the best choice for very high frequency application demanding low loss requirement for few niche applications in communication and defense industries. Master of Science (Precision Engineering) 2010-04-23T02:25:46Z 2010-04-23T02:25:46Z 2006 2006 Thesis http://hdl.handle.net/10356/36056 application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NTU Library |
| collection |
DR-NTU |
| topic |
DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics |
| spellingShingle |
DRNTU::Engineering::Mechanical engineering::Mechanics and dynamics Hla Phone Maw. Characterization of lead free solder joints in microelectronics assemblies |
| description |
71 p. |
| author2 |
Zhong Zhaowei |
| author_facet |
Zhong Zhaowei Hla Phone Maw. |
| format |
Theses and Dissertations |
| author |
Hla Phone Maw. |
| author_sort |
Hla Phone Maw. |
| title |
Characterization of lead free solder joints in microelectronics assemblies |
| title_short |
Characterization of lead free solder joints in microelectronics assemblies |
| title_full |
Characterization of lead free solder joints in microelectronics assemblies |
| title_fullStr |
Characterization of lead free solder joints in microelectronics assemblies |
| title_full_unstemmed |
Characterization of lead free solder joints in microelectronics assemblies |
| title_sort |
characterization of lead free solder joints in microelectronics assemblies |
| publishDate |
2010 |
| url |
http://hdl.handle.net/10356/36056 |
| _version_ |
1761782090920099840 |