Characterization of lead free solder joints in microelectronics assemblies
71 p.
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Main Author: | Hla Phone Maw. |
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Other Authors: | Zhong Zhaowei |
Format: | Theses and Dissertations |
Published: |
2010
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Subjects: | |
Online Access: | http://hdl.handle.net/10356/36056 |
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Institution: | Nanyang Technological University |
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