Study on the interconnection failure in lead-free soldered assemblies
Lead-free solders have replaced tin-lead solders in electronic products due to European Union laws on restriction of hazardous substances such as lead (Pb) since July 1st, 2006. The electronic industry is prepared for lead-free solder reflow manufacturing of electronics assemblies. Solder is the wea...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | https://hdl.handle.net/10356/5279 |
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| Institution: | Nanyang Technological University |