Study on the interconnection failure in lead-free soldered assemblies

Lead-free solders have replaced tin-lead solders in electronic products due to European Union laws on restriction of hazardous substances such as lead (Pb) since July 1st, 2006. The electronic industry is prepared for lead-free solder reflow manufacturing of electronics assemblies. Solder is the wea...

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書目詳細資料
主要作者: Xu, Luhua
其他作者: Pang Hock Lye, John
格式: Theses and Dissertations
出版: 2008
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在線閱讀:https://hdl.handle.net/10356/5279
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