Fabrication of high brightness light emitting diode

This project was to design and fabricate a high-brightness GaN based light emitting diode (LED) on a <111> silicon substrate using a new light emitting disk structure to enhance the light extraction. The critical breakthrough that enabled fabrication of the first high-brightness blue LED using...

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Main Author: Foo, Fang Wei.
Other Authors: Tang Xiaohong
Format: Final Year Project
Language:English
Published: 2010
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Online Access:http://hdl.handle.net/10356/40292
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-402922023-07-07T17:01:50Z Fabrication of high brightness light emitting diode Foo, Fang Wei. Tang Xiaohong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Microelectronics This project was to design and fabricate a high-brightness GaN based light emitting diode (LED) on a <111> silicon substrate using a new light emitting disk structure to enhance the light extraction. The critical breakthrough that enabled fabrication of the first high-brightness blue LED using GaN on sapphire in the early 1990s by Shuji Nakamura of Nichia Corporation, which opened up the possibilities to create virtually any colour of light especially white LED. LED offers high luminance even on low applied voltage which is the most sought-after goal of researchers and manufacturers, and it is this device that most likely to end a hundred-year reliance on inefficient incandescent lamps. GaN on sapphire has broken new boundary to the world of LED and to tap into the world of semiconductor industry and LED on Si is another major milestone to conquer, since Si offer better thermal dissipation and possible embedded system with microchip; it has been widely experimented and studied. With Si as the substrate material to hold the LED structure and thermal dissipation, it was thinned and etched using DRIE on Si to increase its light extraction capability and efficiency. Our design not only focused on light extraction, improvement on light reflection was also encapsulated into our design by meant of using a reflection cap incorporated using wafer bonding technique. Hence different fabrication steps and materials properties had to be studied and explored to provide the best suitable solution to our LED design. All this research and exploring was to paves a way to realize our goal in fabricating of a high brightness light emitting diode using GaN on Si technology. Bachelor of Engineering 2010-06-14T06:36:01Z 2010-06-14T06:36:01Z 2010 2010 Final Year Project (FYP) http://hdl.handle.net/10356/40292 en Nanyang Technological University 66 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Foo, Fang Wei.
Fabrication of high brightness light emitting diode
description This project was to design and fabricate a high-brightness GaN based light emitting diode (LED) on a <111> silicon substrate using a new light emitting disk structure to enhance the light extraction. The critical breakthrough that enabled fabrication of the first high-brightness blue LED using GaN on sapphire in the early 1990s by Shuji Nakamura of Nichia Corporation, which opened up the possibilities to create virtually any colour of light especially white LED. LED offers high luminance even on low applied voltage which is the most sought-after goal of researchers and manufacturers, and it is this device that most likely to end a hundred-year reliance on inefficient incandescent lamps. GaN on sapphire has broken new boundary to the world of LED and to tap into the world of semiconductor industry and LED on Si is another major milestone to conquer, since Si offer better thermal dissipation and possible embedded system with microchip; it has been widely experimented and studied. With Si as the substrate material to hold the LED structure and thermal dissipation, it was thinned and etched using DRIE on Si to increase its light extraction capability and efficiency. Our design not only focused on light extraction, improvement on light reflection was also encapsulated into our design by meant of using a reflection cap incorporated using wafer bonding technique. Hence different fabrication steps and materials properties had to be studied and explored to provide the best suitable solution to our LED design. All this research and exploring was to paves a way to realize our goal in fabricating of a high brightness light emitting diode using GaN on Si technology.
author2 Tang Xiaohong
author_facet Tang Xiaohong
Foo, Fang Wei.
format Final Year Project
author Foo, Fang Wei.
author_sort Foo, Fang Wei.
title Fabrication of high brightness light emitting diode
title_short Fabrication of high brightness light emitting diode
title_full Fabrication of high brightness light emitting diode
title_fullStr Fabrication of high brightness light emitting diode
title_full_unstemmed Fabrication of high brightness light emitting diode
title_sort fabrication of high brightness light emitting diode
publishDate 2010
url http://hdl.handle.net/10356/40292
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